Conductive pastes for Chip components

Metal MetalContent FiringCondition Application Properties PrintingType Remark
Ni 40~50wt% 1000~1200 °C MLCC – Fine line resolution
– High electric properties
– Ni Size : 150nm ~ 600nm
ScreenGravure Adjustable on demand
– Rheology
– Sintering shrinkage
– Density
Cu 60~70wt% 700~850 °C MLCC – Plating resistance
– Good reliability
ScreenDipping
Ag 50~90wt% 560~900 °C InductorPTCPiezoLTCC – Fine line resolution
– High electric properties
– Good reliability
– Excellent adhesion
ScreenDipping
Al 50~80wt% 650~850 °C PTC – Excellent adhesion
– Good reliability
Screen
Ag/Pd 50~70wt% 900~1200 °C VaristorMLCCPiezo – Fine line resolution
– High electric properties
– Good reliability
Screen