Conductive pastes for Chip components
| Metal | MetalContent | FiringCondition | Application | Properties | PrintingType | Remark |
|---|---|---|---|---|---|---|
| Ni | 40~50wt% | 1000~1200 °C | MLCC | – Fine line resolution – High electric properties – Ni Size : 150nm ~ 600nm |
ScreenGravure | Adjustable on demand – Rheology – Sintering shrinkage – Density |
| Cu | 60~70wt% | 700~850 °C | MLCC | – Plating resistance – Good reliability |
ScreenDipping | |
| Ag | 50~90wt% | 560~900 °C | InductorPTCPiezoLTCC | – Fine line resolution – High electric properties – Good reliability – Excellent adhesion |
ScreenDipping | |
| Al | 50~80wt% | 650~850 °C | PTC | – Excellent adhesion – Good reliability |
Screen | |
| Ag/Pd | 50~70wt% | 900~1200 °C | VaristorMLCCPiezo | – Fine line resolution – High electric properties – Good reliability |
Screen |