NURI Vista rises with MLCC and keep rising with copper nano ink (ETNEWS 11.08.2016)
Date
2016-11-08 13:58
NURI Vista (NURI Telecom’s subsidiary) is speeding up its copper nano ink business for printed electronics.
It is planning to commercialize antenna fields such as near field communication (NFC) and radio frequency identification (RFID).
It replaces silver nano ink, which is commonly used in printed electronics, to reduce the production cost to 20%. The company is expecting copper nano ink will lead the company's growth with the paste for a multilayer ceramic capacitor (MLCC), which has recently started to generate sales.
<Copper Nano Ink for Optical Sintering from Nuri Vista>
NURI Vista (CEO Cho Song Man) said it is considering mass production of copper nano ink for optical sintering with domestic demand companies. Copper nano ink has similar electrical properties as silver nano ink and can print an electrode pattern on a flexible film. The advantages are low price and low resistance. However, the challenge was to overcome the limitations of the process. This is because copper's electrical properties are degraded by corrosion and oxidation when the thermal sintering method commonly used in printed electronics is applied.
NURI Vista has developed an ink that improves the properties of copper nano pastes to maintain electrical properties in the light sintering process. The ink was used to draw a pattern on a substrate and then shine for a short millisecond. Through this process, the pattern is fixed on the substrate and becomes conductive. Due to the low-temperature process, there is little change in physical properties and the processing time is shortened.
The pattern thickness can be adjusted in the range of 8 to 14 micrometers (µm). Making a thick pattern does not rough the surface. Since the pattern can be made thicker than the competitors, various applications are possible depending on the resistance, the form, and the end product.
Lee Kyung-il, Director of Nuri Vista Research Institute, said, “The optical sintering method itself is partially applied to silver nano ink, but the price advantage is great when applied to copper nano ink.” Also, he emphasized, "It can replace most printed electronic applications using silver nano ink."
NURI Vista copper Nano ink is near commercialization.
The company is participating in the 'Nano Material Demand-linked Product Development Technology' project promoted by the government. It is a joint project with a demanding company and applied to actual products. The goal is to replace the silver paste to create an ultra-low-cost RF antenna.
Once this material is commercialized, the NURI Vista business will be in golden age again. Last year, the company succeeded in exporting nickel paste for MLCC and generated sales of about 1.5 billion won. The company generated meaningful sales for the first time in the material business, which invested about 19 billons won.
<Nickel Paste for MLCC from NURI Vista >
A nickel paste composed of 180 nanometers (nm) diameter particles is in mass production.
It is used as an internal electrode that fills in each layer of MLCC. It is best in Korea in Mass production of 180nm paste. The target is a small, high-capacity MLCC with 50 to 80 layers. It is a high value-added product that is 5 to 10 times more expensive than a low-end MLCC paste for 300 nm or more. (omitted)
It is planning to commercialize antenna fields such as near field communication (NFC) and radio frequency identification (RFID).
It replaces silver nano ink, which is commonly used in printed electronics, to reduce the production cost to 20%. The company is expecting copper nano ink will lead the company's growth with the paste for a multilayer ceramic capacitor (MLCC), which has recently started to generate sales.
<Copper Nano Ink for Optical Sintering from Nuri Vista>
NURI Vista (CEO Cho Song Man) said it is considering mass production of copper nano ink for optical sintering with domestic demand companies. Copper nano ink has similar electrical properties as silver nano ink and can print an electrode pattern on a flexible film. The advantages are low price and low resistance. However, the challenge was to overcome the limitations of the process. This is because copper's electrical properties are degraded by corrosion and oxidation when the thermal sintering method commonly used in printed electronics is applied.
NURI Vista has developed an ink that improves the properties of copper nano pastes to maintain electrical properties in the light sintering process. The ink was used to draw a pattern on a substrate and then shine for a short millisecond. Through this process, the pattern is fixed on the substrate and becomes conductive. Due to the low-temperature process, there is little change in physical properties and the processing time is shortened.
The pattern thickness can be adjusted in the range of 8 to 14 micrometers (µm). Making a thick pattern does not rough the surface. Since the pattern can be made thicker than the competitors, various applications are possible depending on the resistance, the form, and the end product.
Lee Kyung-il, Director of Nuri Vista Research Institute, said, “The optical sintering method itself is partially applied to silver nano ink, but the price advantage is great when applied to copper nano ink.” Also, he emphasized, "It can replace most printed electronic applications using silver nano ink."
NURI Vista copper Nano ink is near commercialization.
The company is participating in the 'Nano Material Demand-linked Product Development Technology' project promoted by the government. It is a joint project with a demanding company and applied to actual products. The goal is to replace the silver paste to create an ultra-low-cost RF antenna.
Once this material is commercialized, the NURI Vista business will be in golden age again. Last year, the company succeeded in exporting nickel paste for MLCC and generated sales of about 1.5 billion won. The company generated meaningful sales for the first time in the material business, which invested about 19 billons won.
<Nickel Paste for MLCC from NURI Vista >
A nickel paste composed of 180 nanometers (nm) diameter particles is in mass production.
It is used as an internal electrode that fills in each layer of MLCC. It is best in Korea in Mass production of 180nm paste. The target is a small, high-capacity MLCC with 50 to 80 layers. It is a high value-added product that is 5 to 10 times more expensive than a low-end MLCC paste for 300 nm or more. (omitted)